OUR SERVICES 

At our core, we offer materials testing, inspection, and analysis services tailored to industry needs. Specialising in electronics, we operate across a wide range of sectors. Our capabilities extend from semiconductor-level intricacies to the final built product, allowing us to effectively investigate all types of failures and anomalies. Common issues include:

  • Electrostatic damage

  • Printed circuit board plating issues

  • Interconnect failures (e.g., solder joints, die attach, wire bonds)

  • Current leakage and corrosion-migration

  • Contamination and environmental damage

We strive to develop long-term relationships with our customers delivering market leading materials testing and inspection services that add value to our customers.

Forensic Eyes support at all levels of the value chain. We also deliver bespoke technical training in electronics quality, reliability and failure analysis.

INVESTIGATE

Why products fail and what solutions are needed.

We are experts in conducting root-cause failure investigations.  Whether you are looking for a full 8D report or support with specific elements of an investigation, we are here to help. 

This service uses materials science to gather evidence that can be used to find the root-cause of problems, assign potential liability, define containment actions and resolve the problem to prevent future issues. Common failures include solder joint, wire bond or die attach failures, corrosion-migration, electrostatic damage, PCB via failures and contamination.

INTERCEPT

Preventing failures

We work with our customers to inspect products with trained eyes. We work to specification and in addition, spot imperfections that may indicate underlying problems. We look for trends in quality variation and help you to improve yield, save resources and reduced waste by identifying issues early in the manufacturing process.

This can be carried out in many ways and our flexible service offering can been modified to meet your needs. Typically, this involves training of your staff and/or further inspection of selected product by experts at Forensic Eyes' lab.

INNOVATE

Accelerating new product or process development

We apply the failure analysis process during the product development cycle to help you develop quality, reliable products that have less risk of failure during qualification and use.  With years of experience in the field and a watchful eye on new materials and processes, our consultancy services support your new product and process development teams to efficiently innovate quality, reliable products. 

Forensic Eyes deliver expertise in a wide range of testing, inspection and analytical techniques. We deliver both non-destructive and destructive techniques.

These include:

  • Surface inspection using light microscopy (LM), scanning electron microscopy (SEM) and energy dispersive x-ray (EDX) spectroscopy

  • Micro-section preparation using mechanical grind and polish processes

  • Broad ion beam (BIB) machining

  • Focussed ion beam (FIB) thin section preparation

  • Micro-section analysis using LM, SEM, EDX and transmission electron microscopy (TEM)

  • Hermeticity testing, leak detection and residual gas analysis (RGA)

  • X-Ray, CT Scanning and X-Ray Microscopy

  • Ultrasonic defect detection

  • Scanning Acoustic Microscopy (CSAM)

  • Atomic Force Microscopy (AFM)

  • Mechanical Testing (hardness, tensile testing, shear testing etc)

  • Compositional analysis techniques - ion chromatography (IC), inductively coupled plasma optical emission spectroscopy (ICP-OES)